Thermal Dissipation and Mechanical Design Analysis of Electronic Control Components
(1.Sichuan Institute of Aerospace Electronic Equipment, Chengdu 610199, China; 2.Multi-source Information Intelligent Fusion Key Laboratory of Sichuan Province, Chengdu 610100, China)
Abstract
With the widespread application of hot-swappable electronic control components in integrated systems, the requirements of the systems for their performance and reliability become increasingly stringent. Efficient thermal dissipation and mechanical performance optimization of electronic control components are the key to ensuring their reliability and long service life. To address this issue, thermal dissipation and structural design of electronic control components are carried out. Taking the airborne drive module as an example, this paper introduces the overall design method of the module, adopts the ANSYS finite element software to simulate and analyze the temperature distribution state of the model under the overall environmental requirements as well as the stress and deformation states under mechanical vibration and shock. The simulation results meet the overall design requirements, verify the effectiveness of the structure, and provide important design references for the structural design of electronic control components.
Keywords
control component; structural design; thermal simulation; mechanical simulation
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About the authors
Yang Ningning (1994-), male, Mongolian, from Yingkou, Liaoning, engineer, master's degree, research direction: microelectronic structure design.